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GAM 70
Solder Paste Thickness
Measurement |
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 |
·
Ideal inspection for solder paste
thickness, including fine pitch, for enhanced printing technology and high
precision requirements.
·
Detects various kinds of printing defect
such as bridging, deviation location, etc
·
Laser vision measurement, non-contact and
non-damaging
·
Statistical charts and process capability
index provided as the real-time data for quality control.
·
Easy to
operate, fast gathering and printing of data for reference and quality
control.
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Functions
·
Measure printed solder thickness, height,
length and interval.
·
Providing various kind of statistical
charts, such as the distributive thickness chart,
-R
control chart
·
Process capability index: Cp, Cpm ,Cpk for
reference.
·
Analyze thickness of solder cross-section,
area and volume.
·
Inspect length and thickness for other
kinds of materials.
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Application
·
Printed solder and
copper. |
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Printing For Control Chart
·
-R
control chart.
·
Cp, Cpk, Cpm capability
index. |

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Operation And Measurement
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Display image full screen.
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Easy to sample.
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Easy to operate with Windows interface
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Real-time statistic
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Distributive Thickness Chart
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Display and print the distributive
thickness chart.
·
Display and print all statistics.
·
Analyses the percentage for distributive
thickness.
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Specification |
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Vision Range |
4.55mm x 3.50 mm |
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Magnification |
X50,
X90 |
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Panel Size |
350W
x 265L mm |
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Precision (mm) |
+/-0.0035 mm |
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Screen Resolution |
0.007mm |
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Measurement Method |
Laser Vision |
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Screen |
15"
LCD Monitor |
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Computer Specifications |
IBM
compatible interface |
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Lens |
Color CCD Lens |
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Light |
Circular LED Lighting |
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Focus |
Micro-adjustable focus device |
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Power |
110VAC, 60Hz / 220VAC, 50Hz |
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Dimensions |
350(L) x 400(W) x 350(H) mm |
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Weight |
30
kg |
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Dimensional View |
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Top View
(Units: mm)

Front View
Lateral View
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Information contained in
this data sheet is subject to change without notice
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