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GAM 70 Solder Paste Thickness
Measurement |
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· Ideal inspection for solder paste thickness, including fine pitch, for enhanced printing technology and high precision requirements. · Detects various kinds of printing defect such as bridging, deviation location, etc · Laser vision measurement, non-contact and non-damaging · Statistical charts and process capability index provided as the real-time data for quality control. · Easy to operate, fast gathering and printing of data for reference and quality control.
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Functions · Measure printed solder thickness, height, length and interval.
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Providing various kind of statistical
charts, such as the distributive thickness chart,
· Process capability index: Cp, Cpm ,Cpk for reference. · Analyze thickness of solder cross-section, area and volume. · Inspect length and thickness for other kinds of materials.
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Application · Printed solder and copper. |
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Printing For Control Chart
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· Cp, Cpk, Cpm capability index. |
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Operation And Measurement · Display image full screen. · Easy to sample. · Easy to operate with Windows interface · Real-time statistic
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Distributive Thickness Chart · Display and print the distributive thickness chart. · Display and print all statistics. · Analyses the percentage for distributive thickness.
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Specification |
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Vision Range |
4.55mm x 3.50 mm |
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Magnification |
X50, X90 |
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Panel Size |
350W x 265L mm |
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Precision (mm) |
+/-0.0035 mm |
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Screen Resolution |
0.007mm |
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Measurement Method |
Laser Vision |
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Screen |
15" LCD Monitor |
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Computer Specifications |
IBM compatible interface |
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Lens |
Color CCD Lens |
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Light |
Circular LED Lighting |
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Focus |
Micro-adjustable focus device |
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Power |
110VAC, 60Hz / 220VAC, 50Hz |
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Dimensions |
350(L) x 400(W) x 350(H) mm |
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Weight |
30 kg |
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Dimensional View |
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Top View (Units: mm)
Front View Lateral View
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