SMT Pick and Place, UV Adhesives, Selective Soldering, PC Board Handling Conveyors and other products / technical services. We offer selective soldering, SMT Pick and Place, UV adhesives and conveyors

Medium Production Pick and Place

Medium Production Pick and Place
placeALL® 510	placeALL 600	placeALL 600L		Reflow Ovens	Stencil Printer
placeALL® 510 Small/Medium Production Pick and Place System^
			placeALL® 510 Small/Medium Production Pick and Place System
Product Description
The placeALL® 510 is a modular Pick&Place system and especially useful to build prototypes and small series. It supports a large range of components (chips, FP-components and BGA's), so even the most complex tasks can be handled. An intelligent software and up to 200 possible kitting slots minimize changeover times, which increases productivity for small lot sizes. The placeALL® 510 can easily be upgraded or integrated into an inline system on location.
Features and Options
Modular Pick&Place system			Large range of components
Automatic pick&place			200 possible kitting slots
Prototyping and small-series			Cost-efficient entry
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placeALL® 600 Medium Production Pick and Place System^
			placeALL® 600 Medium Production Pick and Place System
Product Description
The placeALL® 600 has a modular structure and can be used for the assembly of prototypes and small series. With a wide range of handled components, ranging from chips model 0201 up to FP-parts with a pitch of 0.3 mm and BGAs, even complex tasks can be flexibly assembled. With a maximum of 208 possible feeder positions and a intelligent software, changeover times can be reduced to a minimum. The placeALL® machines can be integrated into a SMEMA assembly inline-system.
Features and Options
Entry model			208 possible feeder positions
modular structure			Intelligent software
Wide range of handled components			Short changeover times
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placeALL® 600 L Medium Production Pick and Place System^
			placeALL® 600 L Medium Production Pick and Place System
Product Description
The placeALL® 600 L is built modular and has a larger placement area than the placeALL® 600. The wide range of handled components from 0201 chips up to FP parts with 0.3 mm pitch and BGA's allows the flexible assembly of even complex projects. With 284 feeder positions (or maximum 6 trays) and a intelligent software, changeover times can be reduced to a minimum. Additionally, the whole placement area can be used to assemble large circuit boards (up to 920×360 mm).
Features and Options
Automatic SMT Pick and Place			284 feeder positions
0201 chips up to FP parts with 0.3 mm pitch and BGAs			Intelligent software
Larger placement area (up to 920×360 mm)			Stand alone or in-line High-Performance unit
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Reflow Ovens^
			Reflow Ovens for Small and medium scale
Product Description
Different stand-alone and inline reflow soldering systems with approved glide-zone heat chamber systems are available for lead-free or leaded soldering or for the curing of glue. Outlines of boards or components can be easily measured and analyzed using the integrated thermal sensor. Several multi-channel measuring instruments are also available.
Features and Options
Glide-zone heat chamber system			Integrated thermal sensor
Lead-free or leaded soldering			Stand-alone and inline reflow soldering
Curing of glue			Bench top versions
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Stencil Printer SD 903 ^
			Stencil Printer SD 903
Product Description
The SD 903 semi-automatic stencil printer supports the user during daily work with a defined squeegee pressure . It is adapted to the needs of modern production lines. Its primary fields of use are prototype construction and small to medium assembly projects. Most stencils, fixed frames or quick-clamping devices can be used with the SD 903. It can be configured quickly without using tools so changeover times are minimized and can be upgraded to automatic function.
Features and Options
Table Top Design			Quick Configuration
Manual, Semi Auto or Automatic			Defined Squeegee Pressure
Solder Paste or Glue			Uses most stencil types
Request a Quote Request a Data Sheet ^
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