EMI Materials for Microelectronics
Adhesives for surface mount, die encapsulation, glob topping, potting, die attach, thermally conductive, electrically conductive,
chip coating, dam and fill, underfill, high speed dispense, form in place gaskets, tracking, fixturing, staking, gap filling
EMCAST epoxy adhesives for Micro Electronics and Die attach
| * EMCAST 500 | UV and Thermal Cure Electrically conductive Epoxies |
| * EMCAST 1500 | Single component, UV cure for Potting, encapsulation and chip coating |
| * EMCAST 1700 | Single component, UV cure for assembly, tacking, fixturing, staking , gap filling |
| * EMCAST 1900 | Single component, UV cure conformal coatings |
| * CHIPSHIELD 2000 | Single Component, UV and/or Thermal cure for chip coating and globbing |
| * DIEBOND 4600 | Single component die attach materials for high speed dispensing |
Click here to see choices for dispensing EMI materials
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Click here for Opto Adhesives
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